Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019133990
Kind Code:
A
Abstract:
To provide a wafer processing method by which the depth of a cut groove can be maintained highly accurately.SOLUTION: A wafer processing method comprises: a processing device preparation step in which a processing device is prepared, comprising at least: a chuck table 16 having a hold surface for holding a wafer; cutting means 24 with a freely detachable cutting blade for cutting the held wafer; X-axis feed means for feeding to a process; Y-axis feed means for indexing and feeding; a grinding stone attachment step in which a grinding stone is attached to cutting means; a holding-surface grinding step in which the X-axis feed means is actuated to grind the holding surface of the chuck table by means of the grinding stone, and the Y-axis feed means is actuated to carry out indexing and feeding so as not to exceed the width of the grinding stone, and to grind the holding surface; a blade attachment step in which the grinding stone is detached from the cutting means and the cutting blade is attached; a holding step in which the wafer is held on the holding surface of the chuck table; and a cutting step in which a dividing line is cut.SELECTED DRAWING: Figure 7
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Inventors:
KITAMURA HIROSHI
Application Number:
JP2018012815A
Publication Date:
August 08, 2019
Filing Date:
January 29, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B7/02; B24B27/06; B24B41/06; B24B45/00; B24B47/02
Domestic Patent References:
| JP2009202323A | 2009-09-10 | |||
| JP2005191232A | 2005-07-14 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko