Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2020009872
Kind Code:
A
Abstract:
To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed in each region on a surface partitioned by division schedule lines into individual device chips comprises a polyolefin-based sheet arranging step, an integrating step, a dividing step, and a picking-up step. The polyolefin-based sheet arranging step positions the wafer in an opening of a frame and arranges a polyolefin-based sheet in a rear surface of the wafer and an outer periphery of the frame, the opening housing the wafer. The integrating step heats and presses the polyolefin-based sheet and integrates the wafer and the frame via the polyolefin-based sheet. The dividing step divides the wafer into individual device chips by cutting the wafer along division schedule lines using a cutting device rotatably including a cutting blade. The picking-up step heats the polyolefin-based sheet, pushes up the device chip, and picks up the device chip.SELECTED DRAWING: Figure 4
Inventors:
HARADA SHIGENORI
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
Application Number:
JP2018128894A
Publication Date:
January 16, 2020
Filing Date:
July 06, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B27/06; B24B41/06; H01L21/67
Domestic Patent References:
| JP2002155249A | 2002-05-28 | |||
| JP2016063060A | 2016-04-25 | |||
| JP2012230930A | 2012-11-22 | |||
| JP2012119670A | 2012-06-21 | |||
| JP2003264203A | 2003-09-19 | |||
| JP2009193825A | 2009-08-27 | |||
| JP2011187537A | 2011-09-22 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Tomohiro Okamoto
Kasahara Takahiro