Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2020043145
Kind Code:
A
Abstract:
To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface into individual device chips comprises a polyester-based sheet arranging step, an integrating step, a frame supporting step, a dividing step, and a picking-up step. The polyester-based sheet arranging step arranges a polyester-based sheet on a rear surface of the wafer. The integrating step heats the polyester-based sheet and integrates the wafer and the polyester-based sheet by thermal compression bond. The frame supporting step supports the polyester-based sheet by a frame composed of an inner frame including an opening having a size enough to house the wafer and an outer frame including an opening with a diameter corresponding to an outer diameter of the inner frame by holding an outer periphery of the polyester-based sheet between an outer peripheral wall of the inner frame and an inner peripheral wall of the outer frame using the frame. The dividing step divides the wafer into individual device chips by cutting the wafer. The picking-up step applies ultrasonic waves to the polyester-based sheet and pushes up the device chip.SELECTED DRAWING: Figure 4
Inventors:
HARADA SHIGENORI
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
Application Number:
JP2018167292A
Publication Date:
March 19, 2020
Filing Date:
September 06, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B27/06; B24B41/06; H01L21/67; H01L21/683
Domestic Patent References:
| JP2007165636A | 2007-06-28 | |||
| JP2018088492A | 2018-06-07 | |||
| JP2003264203A | 2003-09-19 | |||
| JP2011187537A | 2011-09-22 | |||
| JP2004091619A | 2004-03-25 | |||
| JP2005191297A | 2005-07-14 | |||
| JP2016063060A | 2016-04-25 |
Foreign References:
| WO2016151911A1 | 2016-09-29 | |||
| WO2018003312A1 | 2018-01-04 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano