Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022180733
Kind Code:
A
Abstract:
To provide a wafer processing method of grinding a front surface of a wafer in which a post region and an outer peripheral residual region surrounding the post region are formed, to grind the height of a post to a desired height.SOLUTION: A processing method by a grinding deice 1 includes the steps of: holding another surface of a wafer on a chick table 32; detecting a height position of the front surface of an outer peripheral residual region of the held wafer with a laser displacement gauge 5; rotating the chuck table, and making grinding means 4 comprising a grinding wheel 425 in which a grinding grinder 426 is annularly distributed approach the wafer held on the chuck table to grind a post region of the wafer so that the grinding grinder passes through a rotational center of the wafer; and detecting the height position of the post to be ground in the post region when executing the grinding step, and terminating the grinding step in the case where a difference between the height position of the post and the height position of the outer peripheral residual region becomes a predetermined value.SELECTED DRAWING: Figure 2
Inventors:
YAMAMOTO DAISUKE
ZHANG RONG
ZHANG RONG
Application Number:
JP2021087389A
Publication Date:
December 07, 2022
Filing Date:
May 25, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B24B7/04; B24B49/04
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko