Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP6657020
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To divide a wafer while leaving a wafer ID and an outer peripheral excessive region.SOLUTION: A wafer (W) has: a device region (W1), and an outer peripheral margin region (W2) surrounding the device region and having therein an ID display part (C) including a wafer ID. First, a separation groove (W4) is formed, which separates the device region and the outer peripheral margin region. Then, after grinding tape (T) is attached to the surface (Wa) side of the wafer, the wafer is ground from the rear side (Wb) of the wafer up to a finish thickness by using a grinding wheel (25). By grinding this, the separation groove is exposed from the rear surface side of the wafer, and the wafer is divided into the device region and the outer peripheral margin region. Thereafter, using a cutting blade (32), a cut is made between the ring-shaped end material (W2a) of the outer peripheral margin region and the device region, and feed for cutting is carried out. The cutting blade is raised between the ring-shaped end material and the device region, and the device region of the wafer is divided.SELECTED DRAWING: Figure 8
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Inventors:
Hideki Koshimizu
Application Number:
JP2016107169A
Publication Date:
March 04, 2020
Filing Date:
May 30, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B7/22; B24B27/06; H01L21/304
Domestic Patent References:
| JP2002373870A | ||||
| JP2000173961A | ||||
| JP2004146487A | ||||
| JP2005101290A | ||||
| JP2164016A | ||||
| JP2013004794A | ||||
| JP9007977A |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki