Title:
ウエーハの加工方法
Document Type and Number:
Japanese Patent JP7313968
Kind Code:
B2
Abstract:
To provide a processing method of a wafer, capable of solving a problem that it is difficult for a base wafer covered with a mold resin to be divided into individual package devices due to the curving of a base wafer.SOLUTION: A processing method of a wafer, contains at least: a hard substrate adhesion step of adhering a hard substrate 20 via a bond layer onto a front surface 10a of a base wafer 10a; an electrode exposure step of exposing an electrode 18 embedded into a device 12 by grinding a back surface 10b of the base wafer 10 to the back surface 10b; a memory chip lamination step of laminating a memory chip 18 at a position corresponding to each device 12 of the back surface 10b of the base wafer 10; and a mold resin coating step of coating a mold resin 52 on the side where the memory chip 18 is laminated. The processing method of the wafer comprises executes a stress softening step of softening a stress of the mold resin 52 caused after the mold resin coating step by thinning and cutting a division scheduled line 14 of the base wafer 10, before the execution of the mold resin coating step.SELECTED DRAWING: Figure 3
Inventors:
Bang Hyunjin
Kim Tae Hee
Kim Jae-sik
John Yojin
Park Young Min
Kim Tae Hee
Kim Jae-sik
John Yojin
Park Young Min
Application Number:
JP2019149063A
Publication Date:
July 25, 2023
Filing Date:
August 15, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B1/00; B24B7/04; B24B27/06; H01L21/304; H01L21/56; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2014225546A | ||||
| JP2000124168A | ||||
| JP201560927A | ||||
| JP201453357A | ||||
| JP2016225511A | ||||
| JP2001127206A | ||||
| JP2002141443A |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko