Title:
ウエーハの加工方法
Document Type and Number:
Japanese Patent JP7321848
Kind Code:
B2
Abstract:
To provide a wafer processing method that can finish a device chip to the desired thickness while measuring the thickness of the device chip without being affected by the waviness of the device chip, even if the size of the device chip is less than 1 mm square.SOLUTION: The wafer processing method includes a groove formation step for forming a groove 18 having a depth corresponding to a thickness of a device chip 44 in a scheduled division line, a protective member placement step of housing a wafer 2 in an aperture 20a of a ring member 20 having the aperture 20a to accommodate the wafer 2 and the thickness equivalent to the thickness of the wafer 2, and placing a protective member 22 between a surface 2a of the wafer 2 and the ring member 20 to integrate the wafer 2 and the ring member 20, and a back grinding step, in which the ring member 20 is ground together with a back surface 2b of the wafer 2 to expose a groove 18 on the back surface 2b of the wafer 2 to divide the wafer 2 into individual device chips 44.SELECTED DRAWING: Figure 6
Inventors:
Omae scroll
Hideki Koshimizu
Hideki Koshimizu
Application Number:
JP2019161971A
Publication Date:
August 07, 2023
Filing Date:
September 05, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B7/04; B24B27/06; H01L21/304
Domestic Patent References:
| JP2018206890A | ||||
| JP2019141949A | ||||
| JP2013094910A | ||||
| JP2001351890A | ||||
| JP10230454A |
Attorney, Agent or Firm:
Atago Patent Attorneys Office
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko