Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP7408237
Kind Code:
B2
Abstract:
The present invention provides a wafer processing method capable of preventing pollution of a conveying path, a device and the like. The wafer processing method grinds or polishes a back surface of a wafer in which devices are respectively formed in a plurality of regions on a front surface divided by predetermined division lines. The wafer processing method includes: a frame unit forming step of positioning a wafer in an opening of a frame having an opening with a size capable of accommodating the wafer, and forming a frame unit in which the wafer and the frame are integrated with each other by thermocompression bonding a thermocompression bonding sheet to the front surface of the wafer and the frame; a holding step in which the frame unit is held by a chuck table of a processing device; a processing step of grinding or grinding the back surface of the wafer by using a processing unit of the processing device; and a cleaning step of removing the frame unit from the chuck table and cleaning the processed wafer.
Inventors:
Suguru Okamura
Keisuke Yamamoto
Keisuke Yamamoto
Application Number:
JP2020005338A
Publication Date:
January 05, 2024
Filing Date:
January 16, 2020
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B7/04; B24B41/06; C09J7/30; C09J123/06; C09J123/12; C09J125/06; C09J167/02; H01L21/304
Domestic Patent References:
| JP2019220550A | ||||
| JP2014075405A | ||||
| JP2019212782A | ||||
| JP2018060873A | ||||
| JP2008114350A | ||||
| JP2017054843A | ||||
| JP2018133371A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano