Title:
ウエーハの加工方法
Document Type and Number:
Japanese Patent JP7461118
Kind Code:
B2
Abstract:
A processing method for a wafer includes a thermocompression-bonding sheet arrangement step of arranging, on a front side of the wafer, a thermocompression-bonding sheet of a size sufficient to cover the wafer, an integration step of pressing the thermocompression-bonding sheet under heat by a planarizing member, so that the thermocompression-bonding sheet is planarized and the thermocompression-bonding sheet and the wafer are integrated together, a grinding step of holding the wafer on a side of the thermocompression-bonding sheet on a chuck table of a grinding apparatus and grinding the wafer to a desired thickness while supplying grinding water to a back side of the wafer, and a thermocompression-bonding sheet rinsing step of unloading the integrated wafer from the chuck table and rinsing the thermocompression-bonding sheet.
Inventors:
Minoru Matsuzawa
Yusuke Fujii
Yusuke Fujii
Application Number:
JP2019149721A
Publication Date:
April 03, 2024
Filing Date:
August 19, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B7/04; B24B55/06; H01L21/304; H01L21/683
Domestic Patent References:
| JP2011165994A | ||||
| JP2009277925A | ||||
| JP2001157959A | ||||
| JP10125768A | ||||
| JP2000038556A |
Foreign References:
| WO2013021644A1 | ||||
| EP1022778A1 |
Attorney, Agent or Firm:
Atago Patent Attorneys Office
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko