PURPOSE: To activate wafer surface and resist without failing the basic property of wafer and resist and improve the adhesion of the wafer and resist.

CONSTITUTION: On the way of supplying a resist to a nozzle 13, the resist 2 is applied with an optional magnetic field by means of a coil 15 for magnetic field formation, it is excited at molecule, atom, electron, atomic group levels without failing the basic property of the resist 2, and its orientational property is improved to activate the resist 2. Then the activated resist 2 is exhausted to semi-center of the surface of a wafer 100 and is spin-coated while rotating the wafer 100. Thus the resist is tightly adhered on the surface of the wafer 100.