PURPOSE: To provide a wafer processor, which can finish highly precisely an end face of an ingot without generating a residual distortion on the end face.

CONSTITUTION: A grindstone spindle 18 is arranged within a hollow spindle 14, a mounting plate 20 is stuck close to the tip part of the grindstone spindle 18. Then the mounting plate 20 is connected with a lapping grindstone 26 lapping an end face 24 of an ingot through a spring member 22 fitted to a circumferential part and the lapping grindstone 26 is supported swingably freely through a spherical body 28. With this construction, since lapping processing can be performed after a slope or a form of the end face 24 of the ingot and it becomes that residual distortion is not generated on the end face, manhours for removal of the distortion on a wafer in a post-processing can be reduced drastically as compared with conventional end face grinding of the ingot. Then since lapping processing of the end face 24 of the ingot can be performed after the slope and form, it is eliminated that the ingot 16 is ground off unnecessarily, which is connected also with an improvement in yield of processing of the water.