To provide a wafer protecting member which can be manufactured inexpensively to be disposable for every wafer, and to provide a protecting method of protecting a semiconductor wafer using the wafer protecting member.

The wafer protecting member 2 is formed of a thermally curable resin to be thermally cured, and has flexibility. The wafer protecting member 2 has a long-sized groove 4 formed along the length such that a peripheral edge of the semiconductor wafer is fitted therein. The wafer protecting member 2 is fitted while the peripheral edge of the semiconductor wafer is fitted in the groove 4, and then the wafer protecting member 2 is thermally cured thereafter. Consequently, the semiconductor wafer can be protected. The wafer protecting member 2 is formed of a resin material, so it can be manufactured inexpensively and is disposable for each semiconductor wafer.