To provide a wafer separating device and its method, capable of preventing contamination of a semiconductor device and damages of a semiconductor package.
A wafer separating method includes the steps of forming a trench 218 in a semiconductor wafer along a scribing line, placing a semiconductor wafer on a stage 310 and aligning each semiconductor device 215 to a corresponding hole fixing the semiconductor wafer to the stage 310 through the use of a vacuum, and applying mechanical force to the semiconductor wafer to cut the semiconductor wafer along the scribing line. A wafer-separating device has a top surface for mounting a wafer on a soft structure and having plural holes evacuated to a vacuum to fix the wafer, the soft structure having at least one hole aligned to the bottom of each semiconductor 215 formed on the wafer, and a pressing means for pressing and cutting the wafer along a trench 218 between the semiconductor devices.
| WO/1989/012702 | MODULAR SPUTTERING APPARATUS |
| JP2001148358 | SEMICONDUCTOR WAFER AND DEVIDING METHOD THEREOF |
| JP3230051 | DRYING TREATMENT METHOD AND APPARATUS |
HONG IN PYO
KIN HEIBAN
HO SEIKO
