PURPOSE: To measure wafer itself without a change into a chip, and to measure the wafer in-plane distribution of electrical characteristics efficiently by providing each specified wafer support means, probing card, vertical magnetic-field applying means, respective support means for the wafer support means and the probing card and drive mechanism to these means.

CONSTITUTION: A rotatable wafer support means 1, a probing card 2 arranged in parallel with the support means 1, a means 21, which is mounted on both sides so as to hold these means and applies a vertical magnetic field to a wafer 3, each support means 5, 6 for the wafer support means 1 and the probing card 2 disposed outside the magnetic-field applying means 21 and a drive mechanism 7 to at least one of these support means 5, 6 are furnished. The support means 1 such as a wafer holder 1 is arranged between magnetic poles for the means 21 such as a magnetic field generator 21, and fixed by a stand 8 through a holder support arm fixing plate 17 by the support means 5 such as a holder support arm 5. The probing card 2 is also disposed between the magnetic poles for the magnetic field generator 21 in the same manner as the wafer holder 1, and connected to the drive mechanism 7 such as an X-Y-Z moving mechanism 7 through the support means 6 such as a probing-card support arm 6.