Title:
WAFER SUPPORT
Document Type and Number:
Japanese Patent JP2002373929
Kind Code:
A
Abstract:
To provide a wafer support that prevents the warpage of a wafer in handling, can cool the wafer efficiently, and at the same time prevents deterioration due to the heat of a heat-conducting member provided on the back of the wafer.
The wafer support 10 is composed of a substrate 12 and a heat-conducting member 14. The substrate 12 is made of a nickel material. The heat-conducting member 14 is made of silicone rubber 16 mainly. The silicone rubber 16 is blended with Ag fine powder for forming thinly. The Ag fine powder 18 is blended partially with high density, and a plurality of columnar regions 20 are formed while one end faces an upper side and the other faces a lower side.
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Inventors:
YUASA MITSUHIRO
ENJOJI KEIICHI
HONMA KOJI
ENJOJI KEIICHI
HONMA KOJI
Application Number:
JP2001180083A
Publication Date:
December 26, 2002
Filing Date:
June 14, 2001
Export Citation:
Assignee:
TOKYO ELECTRON LTD
CHEMITORONICS CO LTD
CHEMITORONICS CO LTD
International Classes:
C23C16/458; H01L21/683; C30B25/12; C30B31/14; H01L21/00; H01L21/68; H01L21/687; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Tadahiko Ito
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