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Patent Searching and Data


Title:
WAFER SUPPORTING APPARATUS
Document Type and Number:
Japanese Patent JP01150793
Kind Code:
A
Abstract:

PURPOSE: To avoid causing the film thickness nonuniformity or dopant concn. nonuniformity by adding a plate-like member for the gas intake to a boat and rotating it together with the boat to distribute a reactive gas uniformly between wafers.

CONSTITUTION: The end of a wafer 4 is inserted in grooves 5 of posts 1 to hold the wafer 4 with the posts 2, it is housed in a heat-treating furnace to execute the film forming process, doping process, heat treatment, etc. In the treatment, a rotary machine 15 is rotated to rotate a boat 2 together. plate-like members 3 are formed on the posts 2 at specified angle θ1 to the peripheral tangential direction of a disk-like member 1 to thereby positively take a reactive gas inwards in the disk-like member 1. Thus the reactive gas is enough and uniformly taken in between wafers 4, hence the film thickness nonuniformity or dopant concn. nonuniformity is resolved. The specified angle θ1 is pref. 10-80° for efficiently sending the reactive gas between the wafers.


Inventors:
Sato, Nobuyoshi
Application Number:
JP1987000309290
Publication Date:
June 13, 1989
Filing Date:
December 07, 1987
Export Citation:
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Assignee:
KAWASAKI STEEL CORP
International Classes:
H01L21/673; F27D3/12; F27D5/00; H01L21/68; H01L21/67; F27D3/12; F27D5/00; (IPC1-7): F27D3/12; F27D5/00; H01L21/68