To provide a new wafer supporting device and a method for manufac turing the same capable of drastically suppressing generation of particles in a wafer heat treatment process in a semiconductor manufacturing process, for instance, in a CVD process.

A wafer supporting device made of silica glass for mounting a lot of wafers on a lot of annular supporting plates 15 laminated on a plurality of columns in a prescribed wafer-mounting interval in vertical direction has the annular supporting plates with their both surfaces 15a and 15b precisely ground, and then the annular supporting plates with their upper and lower outer and inner peripheral edges chamfered to form chamfers C1, C2, C3, and C4.