Title:
ウエハの表面の洗浄装置及びウエハの表面の洗浄方法
Document Type and Number:
Japanese Patent JP7423980
Kind Code:
B2
Abstract:
To provide a wafer surface cleaning device and a wafer surface cleaning method that can reduce running costs and environmental load, can satisfactorily remove contaminants such as fine particles remaining inside grooves or holes even when a plurality of fine grooves or holes are formed on the surface of the wafer by dry etching, and improve the throughput of wafer cleaning by increasing the rate of water immersion in the groove or hole.SOLUTION: A wafer surface cleaning device according to the present invention includes a cleaning tank 1, gas supply means 2 that supplies easily soluble gas to the surface of a wafer installed in the cleaning tank 1, and solution supply means 3 that supplies a mixed solution of water and alcohol to the surface of the wafer after the easily soluble gas is supplied by the gas supply means 2.SELECTED DRAWING: Figure 1
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Inventors:
Hideaki Iino
Application Number:
JP2019195427A
Publication Date:
January 30, 2024
Filing Date:
October 28, 2019
Export Citation:
Assignee:
Kurita Water Industries Ltd.
International Classes:
H01L21/304; H01L21/3065
Domestic Patent References:
| JP2015088740A | ||||
| JP6181191A | ||||
| JP2008244271A |
Attorney, Agent or Firm:
Yuji Hayakawa
Keisuke Murasame
Keisuke Murasame
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