PURPOSE: To prevent a cut surface from generating a flaw and/or a saw mark, by clamping a wafer train, after a workpiece to be cut finishes cutting, with separately provided take out arms further cutting a workpiece fixing bed again by a wire and taking out said wafer train.

CONSTITUTION: A wire 2, cutting a work to be cut 4, bites at a work fixing bed 1. Next, a wafer train 4i is clamped in a manner being slightly lifted by separately provided, for instance, three wafer take out arms (3-1) (3-2). Next the wire 2 further cuts said fixing bed 1. In this way, if cutting of said fixing bed 1 is finished, the wafer train 4i, being lifted by once moving upward the take out arms (3-1) (3-2), is separated from said fixing bed 1. Subsequently, the wafer train 4i is drawn out to the outside of a wire saw by retracting said take out arms (3-1) (3-2). In this way, a wafer, being taken out without cleaning an abrasive grain or the like accumulated between the wafers after the work finishes cutting, is efficiently taken out with no generation of a saw mark and/or a flaw on the wafer.