PURPOSE: To efficiently take out a cut wafer without damaging a groove of a grooved roller without flaw at the wafer.

CONSTITUTION: A method for taking out a wafer of a wire saw comprises the steps of adhering a slice base 32 to a semiconductor ingot 28 with low- temperature meltable adhesive 33, cutting the ingot 28 to many thin platelike wafers by a wire row, and then heating to melt the adhesive 33 by a heater 36 contained in a work feeding table 26. Thus, since the cut wafers are peeled from the base 32, the peeled wafers are received by a basket 42.