Title:
WAFER THIN-CUTTING AND ABRASION DEVICE
Document Type and Number:
Japanese Patent JPH04229622
Kind Code:
A
Abstract:
PURPOSE: To accurately divide a polishing wheel by slicing a wafer, and polishing an ingot at the same time in a single cycle of a machine. CONSTITUTION: A polishing wheel 28 is coaxially fitted onto a spindle 16 with saw-tooth blade 24 and rotates together with them, to polish an exposed surface 29 of an ingot 12. A polishing disk 30 moves so as to abut against the surface of the ingot and then polishes the surface of the ingot, when a housing 15 moves down next, and the saw teeth slice the ingot 12 to form a wafer. In one cycle of a slicing machine 10, one wafer is cut out of the ingot 12, and at the same time, the exposed surface of the ingot 12 is polished flatly. Consequently, a slicing and polishing device can be obtained which is easily applicable to the slicing and polishing of wafers of various thickness.
Inventors:
ROBAATO II SUTEIAA JIYUNIA
Application Number:
JP11038591A
Publication Date:
August 19, 1992
Filing Date:
May 15, 1991
Export Citation:
Assignee:
SILICON TECHNOL CORP
International Classes:
B23P23/02; B23Q1/48; B23Q5/26; B24B7/22; B24B27/06; B24B41/047; B28D1/00; B28D5/00; B28D5/02; H01L21/304; (IPC1-7): B24B7/22; B28D1/22; B28D5/00; H01L21/304
Attorney, Agent or Firm:
Akira Asamura (3 outside)
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