Title:
WAFER TRANSFER DEVICE AND TRANSFER CONTROL SYSTEM
Document Type and Number:
Japanese Patent JP2701819
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To lessen both a following transfer truck in waiting time and a transfer robot in waiting time induced by the decrease of the number of empty transfer trucks with the increase of the flow rate of transfer lots.
SOLUTION: When a semiconductor substrate is transferred to a next process, it is monitored by a control device 9 that individual trucks 4 on a transfer track 6 are loaded or not. When the loaded individual trucks 4 are lessened as compared with the empty trucks, the trucks 4 are linked together by the attraction of an electromagnet 1 to form a truck train. When the loaded trucks are increased in number compared with that of empty trucks, the attraction of the electromagnet 1 is shut off to separate the truck train into the individual trucks 4. The control device 9 controls both a truck train and an individual truck as a single truck.
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Inventors:
Odajima, Hiroki
Application Number:
JP1995000321481
Publication Date:
October 03, 1997
Filing Date:
December 11, 1995
Export Citation:
Assignee:
NEC CORP
International Classes:
B23Q7/04; B61B13/00; B65G49/07; G05D1/02; H01L21/677; H01L21/68; B23Q7/04; B61B13/00; B65G49/07; G05D1/02; H01L21/67; (IPC1-7): H01L21/68; B23Q7/04; B61B13/00; B65G49/07; G05D1/02