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Patent Searching and Data


Title:
WAFER TRANSFER DEVICE
Document Type and Number:
Japanese Patent JP01164027
Kind Code:
A
Abstract:

PURPOSE: To prevent dust from occurring and to improve cleanness by providing a boat fixation releasing mechanism formed of springs that provide a restoring force to a large cylinder and by equipping a master cylinder that externally provides a releasing force to the large cylinder.

CONSTITUTION: A wafer push-up means 20 transports a wafer 18 held in a wafer holding groove 34 in the form of a comb at the lower side of a cassette 19 or a boat 22 to a wafer holding groove in the form of a comb at an upper side at the upward movement, and returns it to a wafer holding groove 34 in the form of a comb of the cassette 19 or a boat 22. A wafer transfer device having a cassette feed table 17 and a boat feed table 21 is equipped with a clamp plate 3 that fixed the boat 22 from both sides by the force of a spring, a small cylinder 52 that releases the boat fixed by both clamp plate 3 against the spring force, a large cylinder 51 that fixes and releases a boat 22, and a spring 56 that provides a restoring force to this large cylinder 51 on the boat feed table 21. The large cylinder 51 is equipped with a master cylinder 53 that externally provides a releasing force.


Inventors:
Takeda, Shigeru
Application Number:
JP1987000323377
Publication Date:
June 28, 1989
Filing Date:
December 21, 1987
Export Citation:
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Assignee:
KOKUSAI ELECTRIC CO LTD
International Classes:
H01L21/677; H01L21/22; H01L21/68; H01L21/02; H01L21/67; (IPC1-7): H01L21/22; H01L21/68