Title:
ウエハー移送装置
Document Type and Number:
Japanese Patent JP4951677
Kind Code:
B2
Abstract:
An apparatus for transferring a wafer includes a ceramic blade, an electrode, a plurality of pads, a coating layer and a robot arm. The blade supports the wafer, and the electrode is disposed inside the blade. Electric power is applied to the electrode to generate an electrostatic force for holding the wafer. The pads are disposed on an upper surface of the blade, and thus frictional forces may be provided between the wafer and the pads. The coating layer is disposed on the blade. The robot arm is connected with the blade to move the blade.
Inventors:
Butterfly, Sun-Bum
E, can-il
Chun, Byung-jin
Anne, Son-Don
Chang, Fiesok
Choi, Jun-ho
E, can-il
Chun, Byung-jin
Anne, Son-Don
Chang, Fiesok
Choi, Jun-ho
Application Number:
JP2009553511A
Publication Date:
June 13, 2012
Filing Date:
March 03, 2008
Export Citation:
Assignee:
Comico Co., Ltd.
International Classes:
H01L21/677; B25J15/00
Domestic Patent References:
| JP10233434A | ||||
| JP10275853A | ||||
| JP10064986A | ||||
| JP9295882A | ||||
| JP11145266A | ||||
| JP4206545A |
Attorney, Agent or Firm:
Atsushi Honda