Title:
Wafer transfer system
Document Type and Number:
Japanese Patent JP6332153
Kind Code:
B2
Inventors:
Hiroyuki Asai
Application Number:
JP2015117861A
Publication Date:
May 30, 2018
Filing Date:
June 10, 2015
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L21/677; B65G49/07; B65G51/03
Domestic Patent References:
| JP5226457A | ||||
| JP2015009982A | ||||
| JP4137961U | ||||
| JP61133640A | ||||
| JP5032995U | ||||
| JP7115120A |
Attorney, Agent or Firm:
Ken Ieiri