WAFER TREATMENT DEVICE - TOHO KASEI KK

Title:

WAFER TREATMENT DEVICE

Document Type and Number:

Japanese Patent JP2000077500

Kind Code:

A

Abstract:

To decrease the occurrence of miss-transfers particles, damaged wafer and the like, and moreover to realize simplifying of the configuration, reducing size, and shortening the required time.

This device comprises a pair of nearly-shaped wafer supporting plates 42a with a space for accepting a wafer holder for wafer transfer robot, a fixing block 42b provided in a prescribed position of each wafer supporting plate 42a, a pair of clamp levers 42c for holding and releasing a semiconductor wafer with the fixing block 42b, a motor 42e for causing rotation of every wafer support plate 42a from a horizontal state in directions opposite to each other, to a standing state, in a direction parallel with each other, a comb-tooth shaped first supporting stand 41a, a second supporting stand 41b, a first elevating mechanism 41c for elevating the first supporting stand 41a, and a second elevating mechanism 41d for elevating the second supporting stand 41b.

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Inventors:

MAEDA TOKUO
TETSUYA KATSUHIRO
TAGUCHI EIJI

Application Number:

JP24894798A

Publication Date:

March 14, 2000

Filing Date:

September 03, 1998

Export Citation:

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Assignee:

TOHO KASEI KK
DAIKIN IND LTD

International Classes:

B08B3/10; H01L21/304; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B08B3/10; H01L21/304

Attorney, Agent or Firm:

Tsugawa friend

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