PURPOSE: To set wafer placing means and a wafer rapidly to a predetermined temperature by providing a controller for simultaneously operating heating means and cooling means to set the temperature of the placing means by a difference of a heat generating amount and a cooling amount.
CONSTITUTION: When a wafer 400 is conveyed from a processing stage, a hand temperature controller 340 compares a value of a hand temperature detection signal S4 with that of a hand temperature setting signal S1, and so increases a heat generating amount of an electric heater 204 as to raise a temperature of a hand 201. Further, a cooling amount of a refrigerant circulator 310 is reduced. A heater controller 320 is so controlled as to reduce the heat generating amount of the heater 204 if the temperature of the hand 201 approaches a hand set temperature. Thus, the wafer 400 becomes a temperature suitable for delivering it to a conveying stage, and a variation in a crystal structure, a distortion can be prevented in the conveyed wafer 400.
TAMURA NAOYUKI
KATO SHIGEKAZU
NISHIHATA KOJI
TSUBONE TSUNEHIKO
OOHIRAHARA YUUZOU
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