To provide a wafer type temperature sensor capable of automating a temperature measuring process, and preventing deterioration of measurement accuracy even at high temperatures.

The temperature sensor 11 includes a wafer 12; and a plurality of temperature sensors 13 arranged on each partitioned domain by partitioning the upside of the wafer 12 into a plurality of domains, for detecting the temperature of the upside of the wafer 12. Each temperature sensor 13 includes, as components, a linear expansion body 14, a latch mechanism 15 as a displacement regulation means, a reset circuit 16 as a deregulation means, and a scale 17 as a temperature display means. The linear expansion body 14 has a cantilever shape having a fixed end 14a fixed to the wafer 12 and a free end 14b whose position on the wafer 12 is displaced by a temperature change.