ウェーハ及びウェーハの薄化方法並びにウェーハの薄化装置

Title:

ウェーハ及びウェーハの薄化方法並びにウェーハの薄化装置

Document Type and Number:

Japanese Patent JP7419467

Kind Code:

B2

Abstract:

To eliminate wafer damage after performing wafer shape processing and damage of a wafer end face in a step of pressing a polishing tape against an edge portion of the wafer end face.SOLUTION: In a wafer W thinned to a desired thickness by back grinding, an edge portion of a wafer periphery is processed as a chamfered portion W-1 and an upper portion of the chamfered portion W- 1 is horizontally removed from an outer periphery to an inner periphery of the wafer W to a target thickness (T) thinned from an upper surface of the wafer W. When denoting a removal length removed from the outer periphery as L, denoting an angle of the chamfered portion W-1 with respect to a horizon as φ, and denoting a margin as α, the wafer W is processed into a shape so as to satisfy L=T/tan φ + α.SELECTED DRAWING: Figure 5

Inventors:

Shinichi Kishishita

Application Number:

JP2022148244A

Publication Date:

January 22, 2024

Filing Date:

September 16, 2022

Export Citation:

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