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Patent Searching and Data


Title:
WAFER WASHING AND DRYING UNIT
Document Type and Number:
Japanese Patent JPS5295967
Kind Code:
A
Abstract:
PURPOSE:To wash and dry wafer clearly by deflating forcedly the air within the cylinder in use of the jetted gas between the inside wall of vessel and the persienne cylinder surrounding the wafers storage area.

Inventors:
KIYOTA SHIYOUGO
MIZUTANI TETSUYA
Application Number:
JP1227376A
Publication Date:
August 12, 1977
Filing Date:
February 09, 1976
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B08B3/02; B08B3/00; H01L21/30; H01L21/304; (IPC1-7): B08B3/00; H01L21/30