Title:
WAFERLESS MEASURING RECIPE GENERATING SYSTEM
Document Type and Number:
Japanese Patent JP2004031709
Kind Code:
A
Abstract:
To provide a measuring recipe generating system which can automatically generate a measuring recipe without suspension of the operation in a manufacturing line.
In order to generate the measuring recipe for performing a dimensional measurement SEM to evaluate a transfer pattern formed on a wafer based on the CAD data, this system comprises a CAD alignment specifying part 32B for specifying an alignment on a CAD based on the CAD data, and a CAD measuring position indicating part 32A for indicating coordinates of a position on the wafer to be measured and indicating a measuring type. The measuring recipe is generated based on the data from the CAD alignment specifying part 32B and the CAD measuring position indicating part 32A.
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Inventors:
MATSUOKA RYOICHI
Application Number:
JP2002187015A
Publication Date:
January 29, 2004
Filing Date:
June 27, 2002
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
G01B15/00; G05B19/418; H01L21/66; (IPC1-7): H01L21/66; G01B15/00
Attorney, Agent or Firm:
Masaaki Sakagami
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