WALL STRUCTURE CONDUCTING HEAT INSULATION AND HEAT TRANSFER

Japanese Patent JP2002309689

A

To adjust and indoor section at a proper temperature by changing a wall structure into a heat-insulating wall body or a heat-transfer wall body.

The wall structure 20 has high thermal conductive plates 7 forming isothermal surfaces crossed at right angles with the heat-flow direction and directed and arranged, low thermal conductive lattice bodies composed of vertical plates 8 and horizontal plates 9 forming cellular spaces extending in the thickness direction vertically to the surfaces of the plates 7, and a hollow wall body 3 consisting of an external plate 5 and an internal plate 4 partitioning an indoor section 1 and an outdoor section 2. The wall structure 20 functions as a heat-insulating wall body under the closed state of opening sections 10 and 11 by shutters 12 and 13, and flow paths 17 are formed by pivotal moving centering around fulcra 14 of the horizontal plates 9 under the open state of the opening sections 10 and 11 and functions as a heat-transfer wall body.

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MASUOKA TAKASHI
TANIGAWA HIROFUMI
NAKAMURA HIROAKI
ONISHI MITSUHARU
UDA SHINJI
SHIMADA YOSHIMITSU

JP2001119354A

October 23, 2002

April 18, 2001

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FUKUOKA PREF GOV SANGYO KAGAKU
MASUOKA TAKASHI
TANIGAWA HIROFUMI
FUKUOKA PREFECTURE
SHOWA MFG
ARUMU KK
SADENKO CO INC

E04B1/74; E04B2/14; (IPC1-7): E04B1/74; E04B2/14

JPS57102612A	1982-06-25
JP3003017B
JPS58174512A	1983-10-13
JPS59175955U	1984-11-24
JPH01134106A	1989-05-26
JPH03108113A	1991-05-08
JPH06306969A	1994-11-01
JPH09158345A	1997-06-17
JP2000032003A	2000-01-28
JP2001040795A	2001-02-13

Onaka Kazumune

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