Title:
WASHER AND METHOD OF WASHING SUBSTRATE SUCH AS SEMICONDUCTOR WAFER USING IT
Document Type and Number:
Japanese Patent JP3185387
Kind Code:
B2
Abstract:
PURPOSE: To prevent dust from deposition on a substrate again during washing even if dust generate during washing.
CONSTITUTION: A washing device 30 is constituted of a double bath of an inner bath 40 which has an opening 41 opened upwardly and which opens a plurality of piercing holes 43 in a bottom plate; and an outer bath 50 having an opening 51 which is sufficiently wider than the opening 41 of this inner bath 40. After a carrier 1 receiving a substrate such as a wafer 5, etc., from the opening 41 of the inner bath 40 is set, washing liquid Wa flows down uniformly from upwardly of this carrier 1, and waste liquid Wb which has washed substrates is discharged from the piercing holes 43 in the bottom plate of the inner bath 40, and the waste liquid Wb passed through discharging paths 64, 66 formed with surface plates on the both sides of the inner bath 40 and outer bath 50 and is discharged from an opening 51 of the outer bath 50, so that the substrates can be washed.
Inventors:
Minoru Mizuno
Application Number:
JP20821192A
Publication Date:
July 09, 2001
Filing Date:
August 04, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B08B3/04; G03F1/82; H01L21/304; (IPC1-7): H01L21/304; B08B3/04
Domestic Patent References:
| JP60113433A | ||||
| JP499025A | ||||
| JP6412532A | ||||
| JP5166787A |
Attorney, Agent or Firm:
Kuninori Funabashi