Title:
半導体ウエハの不要物除去方法およびその装置
Document Type and Number:
Japanese Patent JP4079679
Kind Code:
B2
More Like This:
Inventors:
Masayuki Yamamoto
Takahiro Senda
Takahiro Senda
Application Number:
JP2002122236A
Publication Date:
April 23, 2008
Filing Date:
April 24, 2002
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/683; H01L21/304; H01L21/68
Domestic Patent References:
| JP2001345368A | ||||
| JP2000091281A | ||||
| JP10074714A |
Foreign References:
| WO1997008745A1 |
Attorney, Agent or Firm:
Tsutomu Sugiya