AQUEOUS PRESSURE-SENSITIVE ADHESIVE RESIN COMPOSITION

Title:

AQUEOUS PRESSURE-SENSITIVE ADHESIVE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2018002915

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an aqueous pressure-sensitive adhesive resin composition which has good emulsification stability and enables a pressure-sensitive adhesive resin layer having excellent water resistance to be formed.SOLUTION: The aqueous pressure-sensitive adhesive composition is provided which contains a reactive polymer emulsifier (A) and a (meth)acrylic polymer (B), and in which a mass ratio of the reactive polymer emulsifier (A) to the (meth)acrylic polymer (B) is 1/99 to 30/70, the reactive polymer emulsifier (A) is a polymer of a monomer mixture containing 1-60 mol% of a monomer (a1) having an epoxy group and 40-99 mol% of a monomer (a2) represented by general formula (1) in a claim 1, and the (meth)acrylic polymer (B) is a polymer of a monomer mixture containing 80-99 mol% of a (meth)acrylate monomer (b1) having a C1-12 alkyl group and 1-20 mol% of a monomer (b2) having a functional group crosslinkable to the epoxy group.SELECTED DRAWING: None

Inventors:

YAMADA AKIHIRO
IWATA TAKAFUMI

Application Number:

JP2016132925A

Publication Date:

January 11, 2018

Filing Date:

July 04, 2016

Export Citation:

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