Title:
WATER BOILER
Document Type and Number:
Japanese Patent JP2888009
Kind Code:
B2
Abstract:
PURPOSE: To cool a semiconductor device to a satisfactory extent in a water boiler having a control device which uses semiconductor devices.
CONSTITUTION: A semiconductor device 6 is mounted to one side of a heat radiating board 8 while the other side is mounted to the surface of a water pipe 3. The portion of the water pipe 3 where the heat radiating board is mounted is made smooth on the surface. This construction makes it possible to cool a semiconductor device of a control circuit 7 to a satisfactory extent by using its water temperature.
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Inventors:
KAWAGUCHI HIROSHI
KAMIMURA MASAHITO
KAMIMURA MASAHITO
Application Number:
JP2240492A
Publication Date:
May 10, 1999
Filing Date:
February 07, 1992
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
F24H9/02; H01L23/473; F24H1/18; (IPC1-7): F24H1/18; F24H9/02; H01L23/473
Domestic Patent References:
| JP313759A | ||||
| JP24163A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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