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Title:
WATER-BORNE RESIN DISPERSION
Document Type and Number:
Japanese Patent JP3630585
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a dispersion to provide a coating film excellent in water resistance and blocking resistance by specifying the calculated Tg of all the polymerizable mono mer components in a dispersion obtd. by emulsion polymerization comprising a first polymerization followed by a multistep main polymerization, the difference of the calculated Tg's of the respective monomer components at the first step of the main polymerization and the final step of the main polymerization, the average particle size of the resin particles obtd., etc.
SOLUTION: The calculated Tg of all the polymerizable monomer components for use in the emulsion polymerization is made to be -10 to 40°C, the calculated Tg of the monomer components for use in the first step of the main polymerization is made to be higher than the calculated Tg of the monomer components for use in the final step by 40°C or more, the average particle size of the resin particles in the water-borne resin dispersion is made to be 50-110 nm, the content of the solid components of the dispersion is made to be 40-60 wt.%, the min. film forming temp. regarding the dispersion is made to be higher than the calculated Tg of all the monomer components by 10°C or more, and the softening temp. of the coating film from the dispersion is made to be higher than the calculated Tg of all the monomer components by 10°C or more. The monomer components are pref. selected from an ester of a cycloalkyl group-contg. alcohol and (meth)acrylic acid, etc.


Inventors:
Kazuhiko Nakamura
Kenji Miyata
Akio Ito
Application Number:
JP16753199A
Publication Date:
March 16, 2005
Filing Date:
June 14, 1999
Export Citation:
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Assignee:
Nippon Shokubai Co., Ltd.
International Classes:
C08L31/02; C08F2/22; C08L39/00; C09D5/00; C09D201/00; (IPC1-7): C08F2/22; C08L31/02; C08L39/00; C09D5/00; C09D201/00
Domestic Patent References:
JP6179726A
JP2000169662A
Attorney, Agent or Firm:
Takehiko Matsumoto