To provide a water-dispersible resin composition for inorganic boards which has an excellent adhesion both to substrates and finish coatings in addition to other properties such as water resistance and hot water resistance.
The water-dispersible resin composition for inorganic boards contains a synthetic resin emulsion comprising (A) a vinyl copolymer obtained by emulsion-polymerizing an unsaturated monomer mixture of a specific composition containing (a) the main monomer component comprising a 1-18C alkyl (meth)acrylate or the like, (b) an acid group-containing polymerizable unsaturated monomer and (c) a silyl group-containing polymerizable unsaturated monomer in the presence of (d) a reactive surfactant in the amount of 0.3-6 wt% of the total amount of the monomers and (B) a water-soluble silicate expressed by formula: M2O-xSiO2 (wherein, M is an alkali metal; x is a positive number of 2.0-7.5). The ratio (solid content weight ratio) of (A) to (B) is (A)/(B)=1/10-10/1.
JP2000086311A | 2000-03-28 | |||
JPH11209553A | 1999-08-03 | |||
JPH11158250A | 1999-06-15 | |||
JPH07102241A | 1995-04-18 | |||
JPH07144979A | 1995-06-06 | |||
JPH02308887A | 1990-12-21 | |||
JPH0925385A | 1997-01-28 | |||
JP2001335735A | 2001-12-04 | |||
JPH08333543A | 1996-12-17 |