Title:
WATER DISPERSION FOR CHEMICAL MECHANICAL POLISHING
Document Type and Number:
Japanese Patent JP2002190458
Kind Code:
A
Abstract:
To provide a water dispersion for chemical mechanical polishing, used for an STI step having mall excessive polishing (dishing) of an insulator film and low occurrence of scratches (surface damages of an insulator material, after polishing).
The water dispersion for chemical mechanical polishing comprises inorganic particles, and nitrogen atom-containing surfactants.
Inventors:
HATTORI MASAYUKI
ANDO MICHIAKI
KAWAHASHI NOBUO
ANDO MICHIAKI
KAWAHASHI NOBUO
Application Number:
JP2000388557A
Publication Date:
July 05, 2002
Filing Date:
December 21, 2000
Export Citation:
Assignee:
JSR CORP
International Classes:
B24B37/00; C09K3/14; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; B24B37/00; C09K3/14; H01L21/306
Domestic Patent References:
| JP2000248263A | 2000-09-12 |
Foreign References:
| WO1998021289A1 | 1998-05-22 |