Title:
WATER-SOLUBLE OR WATER-DISPERSIBLE HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2003003140
Kind Code:
A
Abstract:
To provide a water-soluble or water-dispersible hot-melt adhesive capable of being enhanced in solubility and dispersibility in water and other performance, such as adhesion under a high-temperature and high-humidity condition, heat stability, and coating performance at a low temperature, in a mutually well-balanced manner, and capable of being industrially produced at a low cost.
This water-soluble or water-dispersible hot-melt adhesive contains 0.01-30 pts.wt. of an anionic surfactant and 0.1-50 pts.wt. of a plasticizer based on 100 pts.wt. of a polyvinyl alcoholic resin having an average degree of polymerization of 50-1,200 and a degree of saponification of ≤60 mol%.
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Inventors:
Yamaguchi, Masashi
Furuichi, Hideki
Oharada, Akinobu
Furuichi, Hideki
Oharada, Akinobu
Application Number:
JP2001000185131
Publication Date:
January 08, 2003
Filing Date:
June 19, 2001
Export Citation:
Assignee:
SEKISUI CHEM CO LTD
UNITIKA LTD
UNITIKA CHEM CO LTD
UNITIKA LTD
UNITIKA CHEM CO LTD
International Classes:
C09J129/04; C09J129/00; (IPC1-7): C09J129/04
