Title:
WATER-SOLUBLE PROCESSING LIQUID FOR ABRASIVE GRAIN-FIXED WIRE SAW, AND CUTTING METHOD
Document Type and Number:
Japanese Patent JP2013100446
Kind Code:
A
Abstract:
To provide a water-soluble processing liquid for abrasive grain-fixed wire saw, which is excellent in lubricating properties and permeability and is hardly foamed; and to provide a cutting method using the same.
A water-soluble processing liquid for abrasive grain-fixed wire saw comprises: an alkyleneoxide adduct (A) of polyamine; an acid phosphate (b1) and/or a dicarboxylic acid (b2); and water (C).
Inventors:
KINOSHITA HIROTAKA
OKUMURA KAZUFUMI
TAKAMURA MASAHIKO
SHIMADA HITOSHI
TAMAKI KOJI
OKUMURA KAZUFUMI
TAKAMURA MASAHIKO
SHIMADA HITOSHI
TAMAKI KOJI
Application Number:
JP2012087463A
Publication Date:
May 23, 2013
Filing Date:
April 06, 2012
Export Citation:
Assignee:
NICCA CHEMICAL CO
KOMATSU NTC LTD
KOMATSU NTC LTD
International Classes:
C10M173/02; C10M105/58; C10M107/44; C10M129/42; C10M137/04; C10N30/06; C10N30/18; C10N40/22
Domestic Patent References:
| JP2004043794A | 2004-02-12 | |||
| JP2003165995A | 2003-06-10 | |||
| JP2010029998A | 2010-02-12 | |||
| JP2002144229A | 2002-05-21 | |||
| JP2000296455A | 2000-10-24 |
Foreign References:
| WO2009028710A1 | 2009-03-05 | |||
| WO2004092312A1 | 2004-10-28 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama