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Title:
WATER-SOLUBLE PROCESSING LIQUID FOR FIXED ABRASIVE GRAIN WIRE SAW AND CUTTING METHOD
Document Type and Number:
Japanese Patent JP2013216755
Kind Code:
A
Abstract:

To provide a water-soluble processing liquid for fixed abrasive grain wire saw, which is excellent in lubricity and permeability and is easy to recycle, and a cutting method using the same.

A water-soluble processing liquid for fixed abrasive grain wire saw contains: an alkylene oxide adduct of polyamine (A); an acidic phosphate (B) represented by the following general formula (I); and water. (R1O-(R2O)y)x-PO(OH)3-x (I). [In the formula, x represents 1 or 2; y represents a number of 1-14 when x is 1, and represents a number of 0-14 when x is 2, two pieces of y may be the same or different, and at least one of two pieces of y is alkyl or alkenyl; R1 represents 4-22C alkyl or alkenyl, and when x is 2, two pieces of R1 may be the same or different; and R2O represents 2-4C oxyalkylene, and when x×y is 2 or more, x×y pieces of R2O in the formula may be the same or different].


Inventors:
KINOSHITA HIROTAKA
OKUMURA KAZUFUMI
TAKAMURA MASAHIKO
SHIMADA HITOSHI
MAGOTA SEIICHI
Application Number:
JP2012087462A
Publication Date:
October 24, 2013
Filing Date:
April 06, 2012
Export Citation:
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Assignee:
NICCA CHEMICAL CO
KOMATSU NTC LTD
International Classes:
C10M169/04; B24B27/06; B28D7/02; C10M105/58; C10M105/74; C10M107/44; C10M133/04; C10M137/04; C10M149/22; C10M173/02; H01L21/304; C10N30/00; C10N30/06; C10N40/22
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama