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Title:
WATER-SOLUBLE RESIN COMPOSITION AND METHOD OF FORMING FINE PATTERNS USING THE SAME
Document Type and Number:
Japanese Patent JP2012155304
Kind Code:
A
Abstract:

To provide a water-soluble resin composition for forming fine photoresist patterns by efficiently reducing the size of a contact hole pattern of a photoresist in a semiconductor process.

The water-soluble resin composition comprises a water-soluble polymer represented by (Formula 1) as specified, and a first water-soluble solvent, and is coated and heat-treated on a photoresist layer having a contact hole pattern formed, to reduce the size of the contact hole.


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Inventors:
PARK SANG WOOK
PARK SO-JUN
SEO DONG-CHUL
Application Number:
JP2011073283A
Publication Date:
August 16, 2012
Filing Date:
March 29, 2011
Export Citation:
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Assignee:
KOREA KUMHO PETROCHEM CO LTD
International Classes:
G03F7/40; C08F32/00; H01L21/027
Domestic Patent References:
JP2007121346A2007-05-17
JP2004037571A2004-02-05
JP2009104178A2009-05-14
JP2011524930A2011-09-08
JP2007121346A2007-05-17
JP2004037571A2004-02-05
JP2009104178A2009-05-14
JP2011524930A2011-09-08
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation



 
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