WATER SOLUBLE RESIN COMPOSITION

Japanese Patent JP3950584

B2

PROBLEM TO BE SOLVED: To provide water soluble resin compositions which excel in coating properties on different levels in a resist pattern and dimensional controllability in forming finer patterns and can be crosslinked and cured by an acid supplied from the resist patterns.
SOLUTION: A water soluble resin composition comprises (1) a water soluble resin, (2) a water soluble crosslinking agent, (3) at least one surface active agent selected from an acetylene alcohol, an acetylene glycol, a polyethoxylate of an acetylene alcohol, and a polyethoxylate of an acetylene glycol, and (4) a solvent composed of water or a mixture of water and a water soluble solvent. This water soluble resin composition is coated on a resist pattern and heated, and uncrosslinked portions of the water soluble resin coated layer are developed and removed. Thus, finer trench patterns and hole patterns are effectively formed.

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Takashi Kanda
Hatsuko Tanaka

JP18277899A

August 01, 2007

June 29, 1999

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az Electronic Materials Co., Ltd.

G03F7/11; C08K5/05; H01L21/027; C08K5/06; C08K5/16; C08L29/04; C08L29/14; C08L61/20; C08L71/02; C08L101/14; G03F7/00; G03F7/004; G03F7/40; (IPC1-7): C08L101/14; C08K5/05; C08K5/16; C08L29/04; C08L29/14; C08L61/20; C08L71/02; G03F7/11; G03F7/40; H01L21/027

JP61017138A
JP10073927A
JP11020104A

Hiroki Kaneo
Takeo Noguchi

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