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Title:
WATER-SOLUBLE RESIN
Document Type and Number:
Japanese Patent JPH02102225
Kind Code:
A
Abstract:
PURPOSE:To obtain the tittle resin soluble in water and org. solvents, having a low softening point and exhibiting no blocking even at high temp. and high humidity and excellent film-forming properties by reacting a water-soluble polyalkylene oxide with a specified amt. of a polyisocyanate compd. CONSTITUTION:A polymeric compd. is prepd. by reacting 100 pts.wt. water-soluble polyalkylene oxide (A) contg. 2 or more OH groups with an average MW of 6,000 or larger, 0-10 pts.wt. low-molecular compd. (B) having 2 or more active hydrogen groups with an MW of 500 or smaller and 0-30 pts.wt. oligomer contg. 2 or more OH groups with an MW of 1,000-5,000 with a polyisocyanate compd. (D). In this case, the amt. of the component D to be used is 0.03-10wt.% based on the total amt. of the components A, B and C and the molar equivalent of NCO in the component D is smaller than the total molar equivalent of active hydrogen groups in the component A, B and C. A water-soluble resin with a low softening point, exhibiting neither change in solubility in water caused by heat-treatment nor change in pH and having no blocking characteristics even at high temp. and high humidity and excellent film-forming properties can be obtd. by said method.

Inventors:
KAJITA HIROYUKI
KUMADA YASUYUKI
SAKAI YASURO
SAKURAI TOMIYASU
Application Number:
JP25440788A
Publication Date:
April 13, 1990
Filing Date:
October 07, 1988
Export Citation:
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Assignee:
MEISEI CHEMICAL WORKS LTD
ASAHI CHEMICAL IND
International Classes:
C08G65/32; C08G18/00; C08G18/02; C08G18/06; C08G18/08; C08G18/12; C08G18/48; C08G18/65; (IPC1-7): C08G18/06; C08G18/08; C08G18/48; C08G18/65; C08G65/32
Attorney, Agent or Firm:
Kenmi Niimi (1 person outside)



 
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