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Title:
水締め用土質改良固化材及び水締め用改良土の製造方法並びに水締め工法
Document Type and Number:
Japanese Patent JP4743679
Kind Code:
B2
Abstract:

To provide a soil-improving solidifying material which is used for hydraulic filling and enables the employment of improved dug soil for filling back as a substitute of purchased sand, to provide a method for producing improved soil for hydraulic filling, and to provide a hydraulic filling engineering method.

This soil-improving solidifying material which is used for hydraulic filling and for improving soil into coarse particle soil-like uniform soil that is not converted into mud, even when the soil particles are granulated, solidified and mixed with water, is characterized by comprising quick lime and an inorganic material which comprises aluminum, silicon and calcium in amounts of 10 to 50 wt. %, 10 to 65 wt. % and 2 to 40 wt. % converted into oxides, respectively, after calcined, and whose components have enhanced reaction activities by a calcination treatment. The method for producing the improved soil for hydraulic filling is characterized by adding, stirring and mixing the soil-improving solidifying material for hydraulic filling to dug soil to granulate and solidify the mixture. The hydraulic filling engineering method is characterized by filling back a dug site with the hydraulic filling improved soil obtained by the production method, and then fluidizing the site with water to fill and compact the soil or fill and compact the soil and simultaneously remove the excessive water.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Horio Atsuo
Natsume Hisato
Nishioka Masatoshi
Sakae Kiriyama
Toshihiro Mizuno
Nobuhiro Koseki
Kenji Kido
Application Number:
JP2003380763A
Publication Date:
August 10, 2011
Filing Date:
November 11, 2003
Export Citation:
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Assignee:
Chubu Electric Power Co., Inc.
Kawai Lime Industry Co., Ltd.
International Classes:
C09K17/02; E02F7/00; C09K17/06; C09K103/00
Domestic Patent References:
JP2002088362A
JP2001055756A
JP2003261961A
JP2001019956A
JP2000256669A
JP2000120101A
Attorney, Agent or Firm:
Akira Nishio