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Title:
WATERPROOF COVER AND ELECTRONIC APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2013062332
Kind Code:
A
Abstract:

To realize a waterproof cover which achieves both the thickness reduction of an electronic apparatus and good exterior appearance of a lid member, and to realize the electronic apparatus including the waterproof cover.

This invention relates to a waterproof cover 2 which is attached to an electronic apparatus body 3 so as to cover and expose an opening 4, communicating with the interior of the electronic apparatus body 3, or a component that is attached to the electronic apparatus body 3 and requires waterproofness. The waterproof cover 2 includes: a cover body 8 covering the opening 4 of the electronic apparatus body 3 or the component; and a waterproof member 10 which is formed separately from the cover body 8 and is fixed to the inner side of the cover body 8. The waterproof member 10 has: a frame body 11 having a closed loop shape; and an elastic seal material 12 which is softer than the frame body 11 and adheres to the frame body 11 covering an opening surface of the frame body 11 and a surface of the frame body 11.


Inventors:
ANDO HITOSHI
KAWAMURA TAKASHI
Application Number:
JP2011198974A
Publication Date:
April 04, 2013
Filing Date:
September 13, 2011
Export Citation:
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Assignee:
SHINETSU POLYMER CO
International Classes:
H05K5/06; H04M1/02; H01M2/10
Attorney, Agent or Firm:
Hiroshi Hasegawa