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Patent Searching and Data


Title:
WATERPROOF LAYER AND CONSTRUCTION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2000038776
Kind Code:
A
Abstract:

To prevent generation of a pinhole without being influenced by a crack of backing concrete by arranging a conductive insulating layer on the surface of a concrete structure, and spraying a super speed-curing resin on the outside.

A conductive insulating layer 2 is installed on the surface of a concrete structure 1 such as a heat accumulating tank through a metallic material, and a super speed-curing resin layer 3 is sprayed on or the applied to the outside. A heat insulating layer is installed on the surface of concrete, and a super speed-curing resin may be sprayed on the outside where the conductive insulating layer is installed through an adhesive. The conductive insulating layer 2 is formed of a film-like body such as woven fabric, nonwoven fabric and a net-like body by performing conductive work or a film and foil by performing conductive working. At inspection time, the conductive insulating layer 2 is earthed, and an electrode is approached from the outside of the super speed-curing resin layer 3, or an eddy current type film thickness meter is approached to measure a position of a pinhole and film pressure. Thus, a reliable waterproof layer can be formed without deteriorating executability even in a narrow place.


Inventors:
SASAKI HARUO
SUZUKI TOSHIYUKI
Application Number:
JP20787798A
Publication Date:
February 08, 2000
Filing Date:
July 23, 1998
Export Citation:
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Assignee:
TAISEI CORP
DYFLEX CORP
International Classes:
E04B1/66; B32B13/12; (IPC1-7): E04B1/66; B32B13/12
Attorney, Agent or Firm:
Sakuo Yamaguchi (1 person outside)