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Title:
バスダクト及びバスダクトの接続部防水構造
Document Type and Number:
Japanese Patent JP4632256
Kind Code:
B2
Abstract:

To obtain a contact-type insulating bus duct that can be constructed without increase in a number of bus duct parts and with structural stability maintained.

One of two housing halves is constructed as a lower housing half 12 having: a supporting flat plate portion 12a that, when placed and fixed, supports a laminated insulating coated conductor from beneath; and supporting legs 12b that are substantially perpendicularly extended downward from the long sides of the supporting flat plate portion 12a and whose tips are bent and abutted against a supporting surface. The other housing half is constructed as a upper housing half 14 having: an upper flat plate portion 14a that, when placed and fixed, covers the upper face of the laminated insulating coated conductor; and side face cover portions 12b that are substantially perpendicularly extended downward from the long sides of the upper flat plate portion 14a by a length substantially equal to the laminate thickness of the insulating coated conductor and whose tips are bent and joined with the outer surface of the supporting flat plate portion of the one housing half when installed.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Minoru Yoshida
Yukihiko Yamada
Application Number:
JP2006126525A
Publication Date:
February 16, 2011
Filing Date:
April 28, 2006
Export Citation:
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Assignee:
Kyodo Kaitech Co., Ltd.
International Classes:
H02G5/06
Domestic Patent References:
JP52170298U
JP60162931U
JP9233659A
JP10210639A
JP2001028824A
JP2001327054A
JP60114522U
JP4615557Y2
JP5392193U
JP478277Y2
JP2001182720A
Attorney, Agent or Firm:
Satoshi Eto



 
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