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Title:
防水層のピンホール検査が可能な防水構造
Document Type and Number:
Japanese Patent JP7121177
Kind Code:
B2
Abstract:
To provide a waterproof structure capable of inspecting a pinhole of a waterproof layer by generating a spark at a place where a pinhole of the waterproof layer is present using a high-voltage flaw detector.SOLUTION: The waterproof structure includes a waterproof layer and a conductive primer layer. The conductive primer layer consists of a cured product of a conductive primer. The conductive primer contains a binder resin and a conductive filler. The surface electrical resistance measured according to JIS K6911 of the conductive primer is 1×102 to 1×106 Ω. The viscosity of the conductive primer is 10 to 4000 mPa s. The binder resin is an asphalt-based binder resin. The conductive filler is Ketjen Black with a BET specific surface area of 800 to 1300 m2/g. The content of the conductive filler is 0.5 to 5.0 pts.mass with respect to 100 pts.mass of the binder resin. The thickness of the conductive primer layer is 20 to 500 μm.SELECTED DRAWING: Figure 1

Inventors:
Hiroaki Tamaru
Kamei Masahiro
Abe Kazuhiro
Application Number:
JP2021155985A
Publication Date:
August 17, 2022
Filing Date:
September 24, 2021
Export Citation:
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Assignee:
Tajima Roofing Co., Ltd.
International Classes:
E04D5/00; E04D7/00
Domestic Patent References:
JP2014235047A
JP2013054896A1
JP2011040384A1
JP2007254610A
JP2015190113A
JP2015180714A
JP2007030381A
JP60108632U
JP11157001A
JP2004060192A
JP2002308953A
JP2002220809A
JP2003167091A
JP2000034467A
JP7289989A
JP2002097292A
JP2012215060A
JP2004176315A
JP2016169590A
JP2011173377A
Foreign References:
US5850144
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Nobuo Sekine
Atsushi Ebiya